Amphenol ICC's NeXLev is an established and proven high-density parallel board connector solution to meet current bandwidth demands in many mezzanine applications.
Amphenol ICC's NeXLev is an established and proven high-density parallel board connector solution to meet current bandwidth demands in many mezzanine applications.
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Designed for fast time-to-market and greater simplicity, Chameleon from Amphenol ICC has evolved into a highly adaptable connector solution. It sets a new standard for low profile BGA products with industry-leading flexibility, performance, and density in board-to-board applications.
Amphenol ICC's Lynx™ is a 4-row product offering doubling the density in a 2-row footprint that is suitable for a wide variety of applications in datacom, enterprise server, telecommunication, industrial, medical and test systems.
Amphenol ICC's GIG-Array® connectors are designed to meet the needs of applications up to 10Gb/s requiring up to 296 signal pins per connector.
The MEG-Array ® Mezzanine Connector system from Amphenol ICC provides the high density and high-speed benefits of sa large array supported by the reliability and low costs of standard surface mount PCB assembly.
Amphenol ICC's InfinX high-speed mezzanine connector system is designed to meet the needs of up to 25Gb/s application. The combination of multiple stack heights and multiple sizes allows for optimal design flexibility.
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